|
Test
Method
MIL-STD-883 |
Test
Method
MIL-STD-750 |
Non-Destruct Bond
Strength |
2023 |
2037 |
Internal Visual and
Mechanical |
2014 |
2075 |
Diodes |
2073* |
2073 |
Transistors |
2072* |
2072 |
MOSFETs |
2069* |
2069 |
Microcircuits |
2017 |
N/A |
Passive Devices |
2032 |
N/A |
Hybrids |
2017 |
N/A |
External Visual |
2009 |
2071 |
Physical Dimensions |
2016 |
2066 |
Bond Strength |
2011 |
2037 |
Die Shear |
2019 |
2017 |
Insulation Resistance |
1003 |
1016 |
High Temperature
Stabilization Bake |
1008 |
1032 |
Temperature Cycle |
1010 |
1051 |
ConstantAcceleration |
2001 |
2006 |
Serialization |
N/A |
N/A |
High Temperature
Reverse Bias (HTRB) |
N/A |
1038/1039/1042 |
Ambient (TA) Burn-In |
1015 |
1038/1039/1042 |
Case (TC) Burn-In |
1015 |
1038/1039/1042 |
Particle Impact Noise
Detection (Pind Test) |
2020 |
2025 |
Fine & Gross
leak (Hermetically Sealed) |
1014 |
1071 |
Mechanical Shock |
2002 |
2016 |
Vibration Variable
Frequency & Fatigue |
2007/2005 |
2056/2046 |
Moisture Resistance |
1004 |
1021 |
Stud Torque |
N/A |
2036 |
Terminal Strength(Tension;
Lead Fatigue; Torque; Bending Stress) |
2004 |
2036 |
Resistance to Solvents
(Marking Permanence) |
2015 |
1022 |
Barometric Pressure |
1001 |
1001 |
Solderability |
2003 |
2026 |
Salt Atmosphere |
1009 |
1041 |
Thermal Shock (Liquid
to Liquid) |
1011 |
1056 |
Steady State Life |
1005 |
1026/1027 |
Intermittent Operational
Life |
N/A |
1036/1037 |
Soldering Heat |
N/A |
2031 |
Radiography |
2012 |
2076 |
DPA |
2013 |
2101/2102 |
Die Attach Integrity |
2019 |
2017 |
