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Manufacturing
Capabilities
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- Package Machining & Fabrication
- Semiconductor Wafer Diffusion & Metallization
- Thin Film Resistor Wafer Fabrication & Laser
Trimming
- Package Brazing
- Substrate Printing
- Alumina
- Aluminum Nitride
- BeO
- Direct Bonded Copper
- Thick Film Resistor Active & Passive
Laser Trimming
- Eutectic, Epoxy & Soft Solder
Die Attach
- Wire Bonding (Aluminum & Gold)
- Aluminum 1.25 & 2.0 Mil (Manual)
- Aluminum 5, 6, 8, 10, 12, 15, 18, 20 & 25 Mil
(Manual & Automatic)
- Gold 1, 2, 2.5 and 3 Mil (Manual & Automatic)
- Package Sealing & Encapsulation
- Epoxy Encapsulation
- Resistance Welding
- Seam Seal
- Solder Seal
- Full Range of Environmental Testing
and Screening
- Full Range of Electrical Testing
and Screening
- Solder Dipping & Tin Plating
- Custom & Standard Lead Forming
- Sub Contract Assembly, Electrical & Environmental
Testing and Screening Services
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