• Package Configurations
  - TO-3, TO-5, TO-18, TO-39, TO-63, TO-66, TO-71, TO-72, TO-111, TO-111/I, TO-114, TO-257, TO-257Z, TO-258
  - LCC-20, MO-078, SMD-1, TO-257 Surface Mount
• Wire Bonding
  - Gold wire
  - Aluminum wire
• Die & Substrate Attach
  - Conductive & non conductive epoxy
  - Eutectic (3 alloys)
       Au 80% Sn 20%
       Au 88% Ge 12%
       Au 97% Si 3%
• Getter (upon request)
• Thick Film Pastes
  - Gold Conductor
  - Resistor
  - Glass
• Silver (Back Side Metallization)

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